Multi-Camera Digital Image Correlation Systems for 3D Reconstruction and Pattern Recognition in Pathology

The development of omnidirectional multi-camera digital image correlation (DIC) systems to establish 3D reconstruction and pattern recognition requirements could be a potential breakthrough for pathology.

There are four cameras designed in omnidirectional multi-camera DIC systems, including one camera providing the central subject view while the other three cameras offer co-circular multi-views. These instruments can transfer spatial data onto the image planes so that the intelligent system can adjust the camera parameters with the training images.

Chen presents three experiment results to demonstrate the use of omnidirectional 3D-DIC systems for biomedical research. The first example describes the use of DIC systems to study the mechanical properties of biological tissues. The second example describes the evaluation of mechanical properties of bovine hoof horn in the dehydrated and fully hydrated states. Finally, the omnidirectional 3D-DIC systems are applied to study the evolution process of biological tissues and biomaterials. The noncontact analysis enables the measurement of the relative displacement between biological tissues and biomaterials interfaces.

3D-DIC systems could prove valuable due to simple surface preparation and the ability to acquire displacement with strain measurements over a large range of deformation. Further developments will enable the use of intelligent omnidirectional 3D-DIC systems for in vitro applications.

About the presenter
Yung-Hsiang Chen has been an engineer working at the National Chung-Shan Institute of Science and Technology (NCSIST) for more than four years. He has also worked as an associate engineer/project manager in the National Applied Research Laboratories (NARLabs) for 12 years. Chen’s current research interests focus on developing novel optical technology, machine vision, automated optical inspection systems, metrology, and measurement systems. He has received major awards, including the Outstanding Engineer Award for Chinese Institute of Engineers (CIE), the Outstanding Metrology Engineer Award for Chinese Metrology Society (CMS), the International Outstanding Inventor Lifetime Achievement Award for International Inventor Prize (IIP).

He is a candidate in the power mechanical engineering doctoral program at National Tsing Hua University and in the doctoral program in mechanical and aeronautical engineering from Feng Chia University, a master’s degree in electrical engineering from National Changhua University of Education, and a bachelor’s degree in industrial education and technology from National Changhua University of Education.